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Company Profile
Core Team
Milestones/ Our Timeline
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HOUMO.AI, established in 2020, is founded by Dr. Wu Qiang and several world-class scholars and chip-industrial experts. HOUMO.AI is the first domestic company dedicated to the large computing power chips based on Compute-In-Memory (CIM).
Aiming at the "Memory Wall" problem and performance bottlenecks caused by the separation of computing units and memory in traditional AI computing chip architecture, HOUMO.AI has made a huge breakthrough of the chip performance and power-consumption bottleneck, taking advantages of the frontier CIM technology.
We provide chips high in computing-power, low in power-consumption, together with industrial solutions, which can be generally applied to edge-computing terminals such as unmanned vehicles 、generic robots,as well as cloud reasoning .
HOUMO.AI aims to use subversive technology to create AI chips with "Tenfold Effect" that can meet the needs of super computing power in artificial intelligence and change the world with infinite computing power.
Core Team

Wu Qiang

PhD / Founder & CEO

• PhD, Princeton University, USA
• AMD core member of GPGPU/OPENCL founding team
• Facebook principal scientist
• VP and CTO of Domestic well-known AI chip company
• MICRO-38 Best Paper Award
• One of the 12 Most Influential Scientific and Technological Achievements of the Year, IEEE Micro
• Member of the organizing committee of top academic conferences in chip area (ISCA, etc.), member of the US NSF Cloud Computing Review Committee

Core R&D members come from from worldwide well-known universities such as Princeton University, Stanford University, Penn State University, National University of Singapore, University of California, Tsinghua University, Peking University, University of Electronic Science and Technology, etc. and first-tier chip companies such as AMD, Nvidia, Qualcomm, Broadcom, Huawei HiSilicon, Horizon Robotics, etc.
Our full-stack chip R&D team, together with the software and hardware integration team, have rich experiences in Computing-In-Memory circuit design, tape-out, advanced manufacturing process, and SoC-level chip design. They have led the R&D and mass production of several world-class chips, including GPU, CPU, and high-performance automotive-standardized AI chips.
More than 70% of the team members owned a master or doctor degree.
Milestones / Our Timeline
September 2020, announced Angel Investment (tens of millions of US dollors)
November 2020, HOUMO.AI established
Shanghai R&D center established
Beijing R&D center established
June 2021, "Cultivating Unicorns" in Nanjing
August 2021, announced Pre-A Investment (0.3 billions ¥ yuan)
April 2022, HOUMO.AI completes Pre-A+ round of financing
Shenzhen R&D center established
Investment partners
Contact Us
Find Us:


Nanjing Office  025-58768088
6 / F, Building B, XingZhi Science and Technology Park, Economic and Technological Development Zone,Nanjing,JiangSu,China


BeiJing Office  
Room 1602, Floor 16, Building A, NO.12 Yumin Road,Chaoyang District, Beijing 100000, China,


ShangHai Office  
3 / F,Building 7, No. 999 HaiKe Road, Pudong district, Shanghai,China


Shenzhen Office  
Room 01, 11th Floor, Longsheng Hengbo Center, Intersection of Bulong Road and Jianshe Road, Longhua District, Shenzhen